| Customization: | Available |
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| Chip: | Bk166X Chip |
| Support Network: | Nmea-0183 |
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The EB1010L2RK-GGB is a receiving module that supports dual-band&multi-mode. It has built-in highly integrated GNSS receiver chip, supports multi band and multi system cm4f (main frequency 350mhz, 22nm Technology) chip of Third-generation BeiDou Navigation Satellite System (BDS-3). Besides,it is capable of tracking all global civil navigation systems (BDS,GPS,GLONASS,Galileo,QZSSand SBAS) in all bands.
EB1010L2RK-GGB module is based on the state of art BDS-3 architecture, integrating multi-band and multi-system GNSS RF and base band. This newly designed architecture makes this single chip achieve sub-meter level position accuracy without correction data from ground-based augmentation station and higher sensitivity, greater for improved jam resistance and multipath, provide a highly robust service in complicated
environment.
EB1010L2RK-GGB module contains BK166X positioning engine inside, featuring high sensitivity, low power consumption, and fast TTFF. The superior cold start sensitivity allows it to acquire, track, and get position fix autonomously in difficult weak signal environment. The receiver's superior tracking sensitivity allows continuous position coverage in nearly all outdoor application environments. The high performance signal
parameter search engine is capable of testing 16 million time-frequency hypotheses per second, offering superior signal acquisition and TTFF speed.
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Applications
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Feature
1.Build on high performance,low-power BK166X chip
2.Ultra high Track sensitivity: -163dBm
3. Concurrent reception of dual-band and multi-system satellite signals
4. Supports RTK ; Protocol: RTCM 3.3
5.Supports all civil GNSS signals
6.Supports BDS-3 signal
7. Extremely fast TTFF at low signal level
8. Multipath detection and suppression
9. Works with passive and active antenna
10. Low power consumption: Max [email protected]
11. NMEA-0183 compliant protocol or custom protocol
12. Operating voltage:2.8V to 3.6V
13. SMD type with stamp holes
14. Small form factor: 10.1±0.4 × 9.7±0.2 × 2.2±0.2mm
15. Operating temperature -40 ~ +85ºC
16. RoHS compliant (Lead-free)
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