Customization: | Available |
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Chip: | Bk1662 Chip Set |
Support Network: | Nmea-0183 |
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EB1010L5-BD is a receiving module that supports Single-Band&Multi-Mode. It has built-in highly integrated GNSS receiver chip, supports multi band and multi system cm4f (main frequency 350mhz, 22nm Technology) chip of Third-generation BeiDou Navigation Satellite System (BDS-3). Besides,it is capable of tracking all global civil navigation systems (BDS,GPS,GLONASS,Galileo,QZSS and SBAS) in all
bands.
EB1010L5-BD module is based on the state of art BDS-3 architecture, integrating multi-band and multi-system GNSS RF and base band. This newly designed architecture makes this single chip achieve sub- meter level position accuracy without correction data from ground-based augmentation station and higher sensitivity, greater for improved jam resistance and multipath, provide a highly robust service in complicated
environment. EB1010L5-BD module contains BK1662 positioning engine inside, featuring high sensitivity, low power consumption, and fast TTFF. The superior cold start sensitivity allows it to acquire, track, and get position fix autonomously in difficult weak signal environment. The receiver' s superior tracking sensitivity allows continuous position coverage in nearly all outdoor application environments. The high performance signal parameter search engine is capable of testing 1 6 million time- frequency hypotheses per second, offering superior signal acquisition and TTFF speed. |
Applications
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Features
1,Build on high performance, low-power BK1662 chip set
2,Ultra high Track sensitivity: - 163dBm
3,Concurrent reception of Single-Band and
4,multi- system satellite signals
5,Supports all civil GNSS signals
6,Supports BDS-3 signal
7,Extremely fast TTFF at low signal level
8,(Cold start ≤28s, Hot start ≤1s).
9,Multipath detection and suppression
10,Works with passive and active antenna
11,Low power consumption: Max [email protected]
12,NMEA-0183 compliant protocol or custom protocol
13,Operating voltage:2.8V to 3.6V
14,SMD type with stamp holes
15,Small form factor: 10. 1±0.4 × 9.7±0.2 × 2.2±0.2mm
16,Operating temperature -40 ~ + 125ºC
17,RoHS compliant (Lead-free)
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